Electroplating Analysis

Nyocha ELECTROPLATING

Otu mkpuchi mkpuchi	Mkpuchi Mkpuchi	Agba	Mkpuchi Ọkpụrụkpụ (μm)	Ntụnyere ikike mkpuchi elu mkpuchi mkpuchi			Ngwa akwadoro okpomọkụ (℃)	Esemokwu dị n'elu
Otu mkpuchi mkpuchi	Mkpuchi Mkpuchi	Agba	Mkpuchi Ọkpụrụkpụ (μm)	Nnwale ịgbasa nnu na-anọpụ iche	Ule iru mmiri	Nyocha PCT	Ngwa akwadoro okpomọkụ (℃)	Esemokwu dị n'elu
Plating Ni/Barrel	Ni	Ọlaọcha na-egbuke egbuke	10-20	☆☆☆☆☆	☆☆☆☆☆	☆☆☆☆☆	≤260	36
Ni/Rack Plating	Ni	Ọlaọcha na-egbuke egbuke	10-20	☆☆☆☆	☆☆☆☆☆	☆☆☆☆☆	≤260	36
3+Cr Zn/Blue-White Zn/Barrel Plating	Zn	Acha anụnụ anụnụ&ọcha	5-10	☆☆☆☆	☆☆☆	☆☆☆	≤160	38
3+Cr Zn/Blue-White Zn/Rack Plating	Zn	Acha anụnụ anụnụ&ọcha	5-10	☆☆☆	☆☆☆	☆☆☆
3+Cr Agba Zn/Barrel Plating	Agba Zn	Agba na-egbuke egbuke	5-10	☆☆☆	☆☆☆	☆☆☆
3+Cr Agba Zn/Rack Plating	Agba Zn	Agba na-egbuke egbuke	5-10	☆☆☆	☆☆☆	☆☆☆
Ni+ Chemical Ni Barrel Plating	Ni+Chemical Ni	Ọlaọcha gbara ọchịchịrị	12-20	☆☆☆☆☆	☆☆☆☆☆	☆☆☆☆	≤200	36
Ni+Chemical Ni Rack Plating	Ni+Chemical Ni	Ọlaọcha gbara ọchịchịrị	12-20	☆☆☆☆	☆☆☆☆☆	☆☆☆☆	≤200	36
Ni+Cr	Ni+Cr	Oji gbara ọchịchịrị	12-20	☆☆☆☆	☆☆☆☆☆	☆☆☆☆☆	≤260	36
Teflon	Teflon	isi awọ gbara ọchịchịrị		☆☆☆	☆☆☆	☆☆☆	≤260	36
Ni+Black Ni	Ni+Black Ni	nwa	12-20	☆☆☆☆☆	☆☆☆☆☆	☆☆☆☆☆	≤260	36
Ni+Sn	Ni+Sn	Ọlaọcha na-egbuke egbuke	12-20	☆☆☆☆	☆☆☆☆☆	☆☆☆☆☆	-	36
Ni+ Ag	Ni+ Ag	Ọlaọcha	12-20	☆☆☆☆	☆☆☆☆☆	☆☆☆☆☆	-	36
Ni+Au	Ni+Au	Ọla edo	10-20	☆☆☆☆	☆☆☆☆☆	☆☆☆☆☆	-	36
Epoxy	EPOXY	nwa	10-20	☆☆☆☆☆	☆☆☆☆☆	☆☆☆☆	≤160	36
Ni/NiCu+Epoxy	NiCuNi/NiCu+EPOXY	nwa	15-25	☆☆☆☆☆	☆☆☆☆☆	☆☆☆	≤160	36
Passivation/Phosphatization	Phosphoric / Passivation	isi awọ gbara ọchịchịrị	1-3	-	-	-	≤240	37
mkpuchi mkpuchi Nano	Ihe mkpuchi Nano	Agba ntụ ntụ nwa	15-30	☆☆☆☆☆☆	☆☆☆☆☆☆	☆☆☆☆☆☆☆	≤300	33

AKWỤKWỌ

1. SST Environment: 35 ± 2 ℃, 5% NaCl, PH = 6.5-7.2, nnu na-agba mmiri 1.5ml / Hr.

2. PCT Environment: 120 ± 3 ℃, 2-2.4atm, mmiri distilled PH = 6.7-7.2 , 100% RH

Biko kpọtụrụ anyị maka arịrịọ ọ bụla pụrụ iche